Statistics

Electronic Component Manufacturing Employment Statistics

U.S. payroll, subsector, occupation, projection, wage, and historical employment figures from BLS sources.

Contents

Electronic component manufacturing employment statistics: monthly U.S. payroll levels in 2025

The Bureau of Labor Statistics’ CES Table B-1b reports employees on U.S. nonfarm payrolls, with figures presented in thousands and not seasonally adjusted. Its NAICS 3344 row covers “Semiconductor and other electronic component manufacturing.” These monthly readings describe distinct months; they are not annual averages or a count of everyone working in a broader electronics economy. The supplied observations run from May through October 2025, so they provide a six-month view rather than a full-year series. (BLS, Employment and Earnings Table B-1b)

Month in 2025Employees (thousands)
May369.9
June371.9
July373.3
August374.8
September373.1
October376.6

The series rises from 369.9 thousand in May to 376.6 thousand in October, though it does not increase in every month: September’s 373.1 thousand is below August’s 374.8 thousand. The table’s reported September-to-October over-the-month change is 3.5 thousand employees. That published change is the appropriate figure to cite for that comparison; the monthly series should not be presented as seasonally adjusted. (BLS, Employment and Earnings Table B-1b)

The measure is a payroll employment series, not a household survey count, job-opening total, or estimate of the number of individual people who have ever worked in the field. The industry label is also specific: the total does not mean all manufacturing jobs involving electronics, nor all workers in technology occupations. Its value is in making a consistent comparison across the same industry row and months. (BLS, Employment and Earnings Table B-1b)

Electronic component manufacturing employment statistics by component subsector

Within the broader component industry, CES Table B-1b separately lists three detailed groups in the checked monthly readings. Their labels distinguish semiconductor and related device manufacturing; bare printed circuit board and printed electronic circuit assembly manufacturing; and a grouped category covering capacitors, resistors, coils, transformers, other inductors, electronic connectors, and other electronic components. Values below remain in thousands of U.S. nonfarm payroll employees and are not seasonally adjusted. (BLS, Employment and Earnings Table B-1b)

Component groupMay 2025June 2025July 2025August 2025September 2025
Semiconductor and related device manufacturing185.9181.7182.1181.8181.4
Bare printed circuit board and printed electronic circuit assembly manufacturing84.386.487.287.686.5
Capacitor, resistor, coil, transformer, other inductor, electronic connector, and other electronic component manufacturing99.7103.8104.0105.4105.2

The semiconductor and related device group has the largest of these three reported levels in each displayed month. Its May value is 185.9 thousand, followed by 181.7 thousand in June and readings of 182.1, 181.8, and 181.4 thousand from July through September. The printed-circuit group moves from 84.3 thousand in May to a high displayed value of 87.6 thousand in August, then reads 86.5 thousand in September. The broad grouped category covering passive components, connectors, and other components rises from 99.7 thousand in May to 105.4 thousand in August, followed by 105.2 thousand in September. (BLS, Employment and Earnings Table B-1b)

These are source-defined industry groupings, not a complete product taxonomy. In particular, the final row combines several component types, so its employment level cannot be assigned separately to capacitors, connectors, or any other one item from this evidence. The table also stops at September for the detailed rows in the checked observations; October’s 376.6 thousand figure above is the broader NAICS 3344 total and should not be mistaken for a detailed subsector reading. (BLS, Employment and Earnings Table B-1b)

Electronic component manufacturing employment statistics: occupational mix in 2024

BLS Occupational Employment and Wage Statistics (OEWS) provides a different view: occupation-specific estimates for workers employed in the semiconductor and other electronic component manufacturing industry. The May 2024 industry chart identifies its ten largest occupations. The figures below are employment estimates for those named occupations in that industry, not a full occupational inventory and not the industry’s total employment. (BLS, Data tables for OEWS industry charts, May 2024)

OccupationMay 2024 employment
Electrical, electronic, and electromechanical assemblers (except coil winders, tapers, and finishers)55,440
Semiconductor processing technicians30,330
Industrial engineers20,320
Software developers19,420
Inspectors, testers, sorters, samplers, and weighers17,440
Computer hardware engineers16,530
Miscellaneous assemblers and fabricators13,500
Electronics engineers, except computer11,670
First-line supervisors of production and operating workers10,740
Electrical and electronic engineering technologists and technicians10,300

The largest listed occupation is electrical, electronic, and electromechanical assemblers, with 55,440 estimated jobs. Semiconductor processing technicians number 30,330. The remaining listed roles show that the industry’s largest occupations include engineering, software development, inspection, supervision, and technical support alongside assembly and processing work. The source provides counts by occupation; it does not establish why employers need those roles or how duties are divided at individual facilities. (BLS, Data tables for OEWS industry charts, May 2024)

OEWS occupation estimates and CES payroll readings should be read as separate statistical products. The OEWS values refer to May 2024 occupation estimates; the CES figures above refer to monthly nonfarm payroll employment in 2025. Their periods and measurement frameworks differ, so the occupational counts are useful for describing the mix of major roles, not for reconciling to a particular 2025 monthly payroll total. The chart’s focus on the ten largest occupations also means smaller occupations are not represented in this list. (BLS, Data tables for OEWS industry charts, May 2024)

Electronic component manufacturing employment statistics: projected jobs and wages

BLS manufacturing projection tables place semiconductor and other electronic component manufacturing among detailed manufacturing industries with projected job growth. Table 2 reports 392,300 wage-and-salary jobs for the industry in 2024 and projects 436,800 in 2034, with a projected numeric increase of 44,500 jobs over 2024–34. Table 1 reports projected employment growth of 11% for the same industry and period. These are projections, not observed future outcomes. (BLS, “Producing the goods of the future: Job opportunities in manufacturing”)

MeasureReported valuePeriod or reference
Wage-and-salary employment392,3002024 baseline
Wage-and-salary employment436,800Projected 2034
Projected numeric employment change44,500 jobs2024–34
Projected percentage employment change11%2024–34
Median annual wage$73,9802024

The table’s 2024 median annual wage is $73,980. It is a historical wage measure for 2024, not a forecast of what workers will earn in 2034. The employment baseline and projection refer to wage-and-salary jobs, so they should not be silently converted into a count of all workers under another employment definition. Likewise, 44,500 is the source’s reported projected numeric change and 11% is its reported percentage change; both retain the BLS projection period of 2024–34. (BLS, “Producing the goods of the future: Job opportunities in manufacturing”)

These figures support a forward-looking description of expected employment levels and the 2024 wage benchmark. They do not specify a guaranteed hiring path in each intervening year, nor do they break the projected industry total into the detailed component groups listed in the monthly CES table. The projection is therefore useful at the broader industry level, while the CES and OEWS measures answer different questions about observed payroll levels and occupational composition. (BLS, “Producing the goods of the future: Job opportunities in manufacturing”)

Electronic component manufacturing employment statistics in 2006 QCEW records

BLS Quarterly Census of Employment and Wages (QCEW) annual averages provide a historical benchmark for private-industry employment by six-digit NAICS. In 2006, the broader semiconductor and electronic component manufacturing category, NAICS 3344, recorded annual average employment of 456,389. The same table lists detailed component industries for that year. These records are historical and should not be treated as current component-level employment estimates. (BLS, Table 2: Private industry by six-digit NAICS industry and government by level of government, 2006 annual averages)

2006 private-industry NAICS categoryAnnual average employment
Semiconductor and electronic component manufacturing (3344)456,389
Electron tube manufacturing (334411)7,218
Bare printed circuit board manufacturing (334412)57,824
Semiconductors and related device manufacturing (334413)227,870
Electronic capacitor manufacturing (334414)7,596
Electronic resistor manufacturing (334415)5,534
Electronic coils, transformers, and inductors (334416)10,992
Electronic connector manufacturing (334417)18,917
Printed circuit assembly manufacturing (334418)53,496
Other electronic component manufacturing (334419)66,942

The QCEW table labels these figures as annual average employment for U.S. private industry. Its categories offer a snapshot of how employment was distributed across the reported NAICS structure in 2006: semiconductors and related devices recorded 227,870, while other electronic component manufacturing recorded 66,942 and bare printed circuit board manufacturing recorded 57,824. Each value belongs to that year’s classification and annual-average measure. (BLS, Table 2: Private industry by six-digit NAICS industry and government by level of government, 2006 annual averages)

The historical table’s detailed labels do not map one-for-one to every later CES label. For example, the 2006 QCEW table lists printed circuit board manufacturing and printed circuit assembly manufacturing separately, while the later CES detail cited here includes a combined bare printed circuit board and printed electronic circuit assembly category. Comparisons across these products and years need to preserve the source’s definitions, dates, and units. The 2006 record is valuable as a dated reference point, not as a substitute for a present-day component breakdown. (BLS, Table 2: Private industry by six-digit NAICS industry and government by level of government, 2006 annual averages)

Sources

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